PCBS (Printed Circuit Board)
Part Number:PCBs F
Item No:HKC260
-Base Laminate Material : FR-4 -Thickness (mm) : 1.2 -Min. Line Space (mm) : 0.13 -Min. Line Width (mm) : 0.14 -Min. Hole Diameter (mm) : 0.20 -Max. Board Size (mm) : 406 x 510 -Technology Type : Plated-through hole -Solder Mask : LPI -Coating : Entek -Tooling : 4-7 Days -Quality Standard : UL, IPC II -Manufacturing Facilities : CNC Drilling/Routing/Silkscreen
Part Number:PCBs D
Item No:HKC258
-Base Laminate Material : FR-4 -Thickness (mm) : 1.0 -Min. Line Space (mm) : 0.17 -Min. Line Width (mm) : 0.30 -Min. Hole Diameter (mm) : 0.30 -Max. Board Size (mm) : 347 x 415 -Technology Type : Plated-through hole -Solder Mask : LPI -Surface Plating : Immersion Gold -Tooling : 4-7 Days -Quality Standard : UL, IPC II
Part Number:PCBs-06
Item No:HKC253
Base laminate material: FR-4 Thickness (mm): 1.2 Minimum line space (mm): 0.15 Minimum line width (mm): 0.15 Minimum hole diameter (mm): 0.50 Maximum board size (mm): 305 x 520 Technology type: Plated-through hole Solder mask: LPI Surface plating: Tin lead Coating: Entek Tooling: 4 to 7 days Quality standard: UL, IPC II
Part Number:PCBs L
Item No:HKC266
-Base Laminate Material : FR-4 -Thickness (mm) : 1.6 -Min. Line Space (mm) : 0.20 -Min. Line Width (mm) : 0.23 -Min. Hole Diameter (mm) : 0.30 -Max. Board Size (mm) : 340 x 300 -Technology Type : Plated-through hole -Solder Mask : Dry Film, SMOBC, LPI -Surface Plating : Tin Lead -Coating : Hot Air Leveling -Tooling : 4-7 Days -Quality Standard : UL, IPC II -Manufacturing Facilities : CNC Drilling/Routing/Hot Air Leveling/Silkscreen
Part Number:PCBs J
Item No:HKC264
-Base Laminate Material : FR-4 -Thickness (mm) : 1.2 -Min. Line Space (mm) : 0.15 -Min. Line Width (mm) : 0.13 -Min. Hole Diameter (mm) : 0.20 -Max. Board Size (mm) : 305 x 406 -Technology Type : Plated-through hole -Solder Mask : LPI -Surface Plating : Immersion Gold -Tooling : 4-7 Days -Quality Standard : UL, IPC II
Part Number:PCBs H
Item No:HKC262
-Base Laminate Material : FR-4 -Thickness (mm) : 1.2 -Min. Line Space (mm) : 0.15 -Min. Line Width (mm) : 0.15 -Min. Hole Diameter (mm) : 0.50 -Max. Board Size (mm) : 305 x 520 -Technology Type : Plated-through hole -Solder Mask : LPI -Surface Plating : Tin Lead -Coating : Entek -Tooling : 4-7 Days -Quality Standard : UL, IPC II
Part Number:PCBs E
Item No:HKC259
-Base Laminate Material : FR-4 -Thickness (mm) : 1.0 -Min. Line Space (mm) : 0.15 -Min. Line Width (mm) : 0.15 -Min. Hole Diameter (mm) : 0.30 -Max. Board Size (mm) : 347 x 415 -Technology Type : Plated-through hole -Solder Mask : LPI -Surface Plating : Immersion Gold -Tooling : 4-7 Days -Quality Standard : UL, IPC II
Part Number:PCBs B
Item No:HKC257
-Base Laminate Material : FR-4 -Thickness (mm) : 0.8 -Min. Line Space (mm) : 0.12 -Min. Line Width (mm) : 0.12 -Min. Hole Diameter (mm) : 0.15 -Max. Board Size (mm) : 340 x 415 -Technology Type : Plated-through hole -Solder Mask : LPI -Surface Plating : Flash Gold -Tooling : 4-7 Days -Quality Standard : UL, IPC II
Part Number:PCBs A
Item No:HKC256
-Base Laminate Material : FR-4 -Thickness (mm) : 1.6- -Min. Line Space (mm) : 0.17 -Min. Line Width (mm) : 0.20 -Min. Hole Diameter (mm) : 0.50 -Max. Board Size (mm) : 240 x 500 -Technology Type : Plated-through hole -Solder Mask : SMOBC, LPI -Surface Plating : Tin-lead, Gold -Coating : Hot Air Leveling -Tooling : 4-7 Days -Quality Standard : UL, IPC II -Manufacturing Facilities : CNC Drilling/ Routing/ Hot Air Leveling/ Silkscreen
Item No:HKC64
Hot Air Levelling Gold Finger Plating Country (Countries) of Origin : China Minimum Orders : USD1,000 Payment Methods : L/C or T/T Delivery Lead Time : 2 - 4 weeks
