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    multi-layer pcb (3+3)

    Item No:HKC8427

    We are especially in producing all kinds of exact PCBs, including single-sided, double-sided, and multi-layer board (1-16 L). The products are widely used in computer satellite, communication equipment, computer & network, medical treatment equipment and household electric appliance. The productivity is as follow: Soldermask: Wet green paint, dry green paint, UV paint, Base material: FR-4, 94vo, CEM-1, CEM-3, 94HB. Surface finishes: Hot air solder leveling (tin, tin lead), immersion gold (tin, silver), OSP, Selective immersion gold, gold plating. FR-4 1.09MM 6 LAYERS OSP

    multi-layer pcb (3+3)

     

    MILTI-LAYER PCB

    Item No:HKC8419

    We are especially in producing all kinds of exact PCBs, including single-sided, double-sided, and multi-layer board (1-16 L). The products are widely used in computer satellite, communication equipment, computer & network, medical treatment equipment and household electric appliance. The productivity is as follow: Soldermask: Wet green paint, dry green paint, UV paint, Base material: FR-4, 94vo, CEM-1, CEM-3, 94HB. Surface finishes: Hot air solder leveling (tin, tin lead), immersion gold (tin, silver), OSP, Selective immersion gold, gold plating. TG 1.6MM 16 LAYERS IMMERSION GOLD

    MILTI-LAYER PCB

     

    Four-layered PTH PCBs with HAL /LPI Solder Mask and Tin Lead Plated

    Part Number:PCBs P

    Item No:HKC270

    -Base Laminate Material : FR-4 -Thickness (mm) : 1.6 -Min. Line Space (mm) : 0.20 -Min. Line Width (mm) : 0.15 -Min. Hole Diameter (mm) : 0.40 -Max. Board Size (mm) : 305 x 406 -Technology Type : Plated-through hole -Solder Mask : LPI -Surface Plating : Tin Lead -Coating : Hot Air Leveling -Tooling : 4-7 Days -Quality Standard : UL, IPC II -Manufacturing Facilities : CNC Drilling/Routing/Hot Air Leveling/Silkscreen

    Four-layered PTH PCBs with HAL /LPI Solder Mask and Tin Lead Plated

     

    Four-layered PTH PCBs with LPI Solder Mask, Tin Lead Plated and Immersion Gold coated

    Part Number:PCBs O

    Item No:HKC269

    -Base Laminate Material : FR-4 -Thickness (mm) : 1.0 -Min. Line Space (mm) : 0.21 -Min. Line Width (mm) : 0.20 -Min. Hole Diameter (mm) : 0.45 -Max. Board Size (mm) : 255 x 406 -Technology Type : Plated-through hole -Solder Mask : LPI -Surface Plating : Tin Lead -Coating : Immersion Gold -Tooling : 4-7 Days -Quality Standard : UL, IPC II -Manufacturing Facilities : CNC Drilling/Punching/Silkscreen

    Four-layered PTH PCBs with LPI Solder Mask, Tin Lead Plated and Immersion Gold coated

     

    Four-layered PTH PCBs with HAL/Dry Film, SMOBC/ LPI Solder Mask

    Part Number:PCBs L

    Item No:HKC266

    -Base Laminate Material : FR-4 -Thickness (mm) : 1.6 -Min. Line Space (mm) : 0.20 -Min. Line Width (mm) : 0.23 -Min. Hole Diameter (mm) : 0.30 -Max. Board Size (mm) : 340 x 300 -Technology Type : Plated-through hole -Solder Mask : Dry Film, SMOBC, LPI -Surface Plating : Tin Lead -Coating : Hot Air Leveling -Tooling : 4-7 Days -Quality Standard : UL, IPC II -Manufacturing Facilities : CNC Drilling/Routing/Hot Air Leveling/Silkscreen

    Four-layered PTH PCBs with HAL/Dry Film, SMOBC/ LPI Solder Mask

     

    Four-layered PTH PCBs with HAL/Dry Film, SMOBC/ LPI Solder Mask

    Part Number:PCBs K

    Item No:HKC265

    -Base Laminate Material : FR-4 -Thickness (mm) : 1.6 -Min. Line Space (mm) : 0.22 -Min. Line Width (mm) : 0.25 -Min. Hole Diameter (mm) : 0.30 -Max. Board Size (mm) : 300 x 450 -Technology Type : Plated-through hole -Solder Mask : Dry Film, SMOBC, LPI -Surface Plating : Tin Lead -Coating : Hot Air Leveling -Tooling : 4-7 Days -Quality Standard : UL, IPC II -Manufacturing Facilities : CNC Drilling/Routing/Hot Air Leveling/Silkscreen

    Four-layered PTH PCBs with HAL/Dry Film, SMOBC/ LPI Solder Mask

     

    Four-layered PTH PCBs with LPI Solder Mask and Immersion Gold plated

    Part Number:PCBs J

    Item No:HKC264

    -Base Laminate Material : FR-4 -Thickness (mm) : 1.2 -Min. Line Space (mm) : 0.15 -Min. Line Width (mm) : 0.13 -Min. Hole Diameter (mm) : 0.20 -Max. Board Size (mm) : 305 x 406 -Technology Type : Plated-through hole -Solder Mask : LPI -Surface Plating : Immersion Gold -Tooling : 4-7 Days -Quality Standard : UL, IPC II

    Four-layered PTH PCBs with LPI Solder Mask and Immersion Gold plated

     

    Four-layered PTH PCBs with LPI Solder Mask and Entek coated

    Part Number:PCBs F

    Item No:HKC260

    -Base Laminate Material : FR-4 -Thickness (mm) : 1.2 -Min. Line Space (mm) : 0.13 -Min. Line Width (mm) : 0.14 -Min. Hole Diameter (mm) : 0.20 -Max. Board Size (mm) : 406 x 510 -Technology Type : Plated-through hole -Solder Mask : LPI -Coating : Entek -Tooling : 4-7 Days -Quality Standard : UL, IPC II -Manufacturing Facilities : CNC Drilling/Routing/Silkscreen

    Four-layered PTH PCBs with LPI Solder Mask and Entek coated

     

    Printed Circuit Board

    Item No:HKC67

    Hot Air Levelling Country (Countries) of Origin : China Minimum Orders : USD1,000 Payment Methods : L/C or T/T Delivery Lead Time : 2 - 4 weeks

    Printed Circuit Board

     

    Printed Circuit Board

    Item No:HKC66

    Hot Air Levelling Country (Countries) of Origin : China Minimum Orders : USD1,000 Payment Methods : L/C or T/T Delivery Lead Time : 2 - 4 weeks

    Printed Circuit Board

     

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